The Digi XBee HPX 900 module is a compact, reliable RF solution designed for long-range connectivity in demanding industrial and embedded applications. Fully compatible and over-the-air interoperable with existing Digi XBee-PRO 900HP deployments, Digi XBee HPX 900 provides a seamless migration path while delivering updated hardware architecture and improved RF filtering for enhanced wireless performance.
Digi XBee HPX 900 delivers 250 mW transmit power while incorporating an integrated SAW (Surface Acoustic Wave) filter to reduce out-of-band interference and improve receiver sensitivity in noisy RF environments. The enhanced filtering enables reliable communication and network performance in industrial and long-range deployments.
Digi XBee HPX 900 supports over-the-air firmware updates, and can be configured using Digi XBee Studio or Digi’s simplified AT and API command sets. The modules are pre-certified for operation in multiple regions with integrated antenna options to simplify RF design, reduce development costs and accelerate time to market for OEM solutions.
Designed for harsh operating environments, Digi XBee HPX 900 supports an industrial temperature range of −40 °C to 85 °C (−40 °F to 185 °F). The module also provides best-in-class DigiMesh networking for reliable mesh or multipoint communications with advanced sleep modes and line-of-sight ranges up to 17 kilometers for agriculture, energy, industrial automation and remote monitoring applications.
Digi XBee HPX 900 is a complete hardware and software platform that works directly out of the box. Digi XBee Tools support the entire IoT development lifecycle — from evaluation, testing and prototyping through manufacturing, deployment and long-term network management.