Digi XBee 3 Global LTE Cat 1, 3G/2G, GNSS, Verizon SIM

Digi XBee 3 Global LTE Cat 1, 3G/2G, GNSS, Verizon SIM

• Hardware
  • Cellular Chipset: Thales PLS63-W
  • Form factor (connector footprint): Digi XBee® 20-pin through-hole
  • Antenna options: 2 U.FL: cellular diversity, 1 U.FL: GNSS; embedded Bluetooth® antenna
  • Dimensions: 30.48 mm x 43.18 mm (1.2 in x 1.7 in)
  • Operating temperature: −40 ºC to 80 ºC (−40 ºF to 176 ºF)
  • SIM size: 4FF Nano
• Interface and I/O
  • Data interface: UART, SPI, USB
  • Operating modes: Transparent and API over serial, PPP over USB
  • Security: Digi TrustFence® security with secure boot and protected JTAG
  • Configuration tools: Digi XBee Studio® (local), Digi Remote Manager® (OTA)
  • Embedded programmability: MicroPython with 8 MB flash / 64 kB RAM
  • I/O: 4 ADC lines (10-bit), 13 digital I/O, I2C
  • Bluetooth: Bluetooth Low Energy (BLE)
• Cellular characteristics
  • Transmit power (4G LTE/3G/2G): 23 dBm / 23.5 dBm / 30-33 dBm
  • Receive sensitivity (4G LTE/3G/2G): 103 dBm / 110 dBm / 108 dBm
  • Supported bands: B1, B2, B3, B4, B5, B7, B8, B12, B13, B18, B19, B20, B25, B26, B28, B38, B40, B41, B66
  • Downlink / uplink speeds: 10 Mbps downlink, 5 Mbps uplink (USB); 921 kbps downlink and uplink (UART)
  • Duplex mode: Full-duplex
• Power requirements (at 3.3 VDC input power)
  • Supply voltage: 2.8 to 5.5 V
  • Peak transmit current: 1050 mA with Bluetooth disabled; 1090 mA with Bluetooth enabled
  • Avg transmit current: 890 mA
  • Avg receive current: 320 mA
• Regulatory and carrier approvals
  • FCC (USA): MCQ-XB3C2 and QIPPLS63-W
  • ISED (Canada): 1846A-XB3C2 and 7830A-PLS63W
  • CE / RED (Europe): Complete
  • RCM (Australia / New Zealand): Pending
  • ANATEL (Brazil): Complete
  • UKCA (United Kingdom): Complete
  • PTCRB, AT&T and Verizon: Complete
• Warranty
  • 1-year