Embedded World North America is an annual gathering of technology providers and enthusiasts, all eager to herald in the newest products, services and technologies. In case you missed EW 2025 or couldn’t make it to every booth and technologist interview, here’s your chance to hear the latest from Digi — a technology leader that is bringing Wi-SUN solutions to developers eager to build resilient and secure products with the latest embedded technologies.
In this interview with Kenneth Kreischer of IMC, embedded technology expert Rob Moore of Digi International discusses Wi-SUN® mesh technology, its benefits, range and self-healing mesh capabilities — as well as its applications in utilities, smart city and other massive networks — and the availability of Digi XBee for Wi-SUN development kits.
Need expert advice on planning your next design and build project, or selecting the right XBee solution for your project? Digi Wireless Design Services can help.
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